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Autodesk Simulation Moldflow Insight Underfill Encapsulation

  

About this Course

The Underfill Encapsulation with Autodesk Simulation Moldflow Insight training course discusses the underfill encapsulation process used in the electronics industry. Discussions in this this Autodesk Simulation Moldflow Insight training include an overview of the underfill encapsulation process and material, and simulating underfill.

Fundamental Topics for this Autodesk Simulation Moldflow Insight training course:

  • Underfill encapsulation overview.
  • Simulating underfill encapsulation molding.
  • Underfill encapsulation materials.

Table of Contents

  • Chapter 1: Underfill Encapsulation Molding Overview
  • Chapter 2: Simulating Underfill Encapsulation Molding
  • Chapter 3: Underfill Encapsulation Material
  • Chapter 4: Underfill Encapsulation Practice
  • Appendix A: Glossary
  • Appendix B: Calculation of Shape Factor in Flip Chip Analysis

Prerequisites:

This training course assumes knowledge of Autodesk Simulation Moldflow Insight, including CAD Model importing, and meshing. Refer to the manual Autodesk Simulation Moldflow Insight Fundamentals for more information on these subjects.

Course Length: 6 hours

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