Autodesk Simulation Moldflow Insight Microchip Encapsulation

  

About this Course

The Microchip Encapsulation with Autodesk Simulation Moldflow Insight training course discusses the simulations capabilities involving microchip encapsulation. The course emphasizes the modeling, setup and results interpretation of the various analyses that can be done. The exercises relate to the skills necessary to perform the needed analyses.

Fundamental Topics for this Autodesk Simulation Moldflow Insight training course:

  • Microchip encapsulation molding overview.
  • Modeling wires for microchip encapsulation.
  • Modeling paddles for microchip encapsulation.
  • Model assembly for microchip encapsulation.
  • Analysis setup for microchip encapsulation.
  • Compression molding with wire sweep.
  • Results interpretation of microchip encapsulation analyses.

Table of Contents

  • Chapter 1 Microchip Encapsulation Molding Overview
  • Chapter 2 Simulating Microchip Encapsulation Molding
  • Chapter 3 Modeling Wires for Microchip Encapsulation Analysis
  • Chapter 4 Modeling Paddles for Microchip Encapsulation Analysis
  • Chapter 5 Model Assembly for Microchip Encapsulation Analysis
  • Chapter 6 Analysis Setup for Microchip Encapsulation Projects
  • Chapter 7 Results Interpretation of Microchip Encapsulation Analysis
  • Chapter 8 Compression Molding with Wire Sweep
  • Appendix A Glossary

Prerequisites:

This training course assumes knowledge of Autodesk Simulation Moldflow Insight, including CAD Model importing, and meshing. Refer to the manual Autodesk Simulation Moldflow Insight Fundamentals for more information on these subjects.

Course Length: 1 day

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